John H. Lau eBooks
eBooks found: 4
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
McGraw-Hill Professional, December 2010
ISBN: 9780071753791
Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for >>
eBook price:
$125.00
Advanced MEMS Packaging
McGraw-Hill Professional, October 2009
ISBN: 9780071626231
An comprehensive guide to advanced MEMS packaging methodsThis book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D >>
eBook price:
$150.00
Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
McGraw-Hill Professional, August 2002
ISBN: 9780071386241
eBook price:
$131.00
Microvias: Low Cost, High Density Interconnects
McGraw-Hill, October 2000
ISBN: 9780071363273
State-of-the-art introduction to high-density interconnect technology.
List Price:
$99.95
eBook price:
$87.99
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